AS4C256M8D3-15BCN

Product Overview

Category

AS4C256M8D3-15BCN belongs to the category of semiconductor memory products.

Use

It is primarily used as a storage component in electronic devices such as computers, smartphones, and embedded systems.

Characteristics

• High storage capacity
• Fast data access speed
• Low power consumption
• Reliable performance
• Compact package size

Package

AS4C256M8D3-15BCN is available in a small form factor package, making it suitable for space-constrained applications.

Essence

The essence of AS4C256M8D3-15BCN lies in its ability to store and retrieve digital information quickly and efficiently.

Packaging/Quantity

AS4C256M8D3-15BCN is typically packaged in trays or reels, with each package containing a specific quantity of memory chips.

Specifications

• Model: AS4C256M8D3-15BCN
• Memory Type: Dynamic Random Access Memory (DRAM)
• Organization: 256 Megabit (256Mb)
• Configuration: 8 Megabytes x 8 bits
• Operating Voltage: 3.3V
• Speed Grade: 15
• Package Type: BGA (Ball Grid Array)
• Operating Temperature Range: -40°C to +85°C

Detailed Pin Configuration

AS4C256M8D3-15BCN features a specific pin configuration that enables proper integration into electronic circuits. The detailed pin configuration is as follows:

1. VDD (Power Supply)
2. DQ0-DQ7 (Data Input/Output)
3. WE# (Write Enable)
4. CAS# (Column Address Strobe)
5. RAS# (Row Address Strobe)
6. CKE (Clock Enable)
7. CS# (Chip Select)
8. DQM (Data Mask)
9. BA0-BA1 (Bank Address)
10. CLK (Clock Input)
11. VSS (Ground)

Functional Features

AS4C256M8D3-15BCN offers the following functional features:

• Random access to stored data
• High-speed read and write operations
• Low power consumption in standby mode
• Easy integration into various electronic systems
• Compatibility with standard memory interfaces

Advantages and Disadvantages

Advantages

• High storage capacity allows for storing large amounts of data.
• Fast data access speed enhances overall system performance.
• Low power consumption helps conserve energy.
• Reliable performance ensures data integrity.
• Compact package size enables integration into space-constrained devices.

Disadvantages

• Being a volatile memory, data is lost when power is removed.
• Requires periodic refreshing to maintain stored data.
• Sensitive to electrical noise and environmental conditions.

Working Principles

AS4C256M8D3-15BCN operates based on the principles of dynamic random access memory (DRAM). It stores data as electrical charges in tiny capacitors within the memory cells. To read or write data, specific row and column addresses are provided, enabling access to the desired memory location.

Detailed Application Field Plans

AS4C256M8D3-15BCN finds applications in various fields, including:

1. Personal Computers: Used as main memory for storing program instructions and data.
2. Mobile Devices: Provides storage for applications, multimedia content, and user data.
3. Networking Equipment: Utilized for buffering and caching data in routers and switches.
4. Automotive Electronics: Enables data storage for infotainment systems and vehicle control units.
5. Industrial Automation: Supports data storage requirements in control systems and monitoring devices.

Detailed and Complete Alternative Models

1. AS4C256M8D3-15BIN: Similar specifications but with an industrial temperature range.
2. AS4C256M8D3-15BCN-T: Tape and reel packaging option for automated assembly.
3. AS4C256M8D3-15BCN-TR: Tape and reel packaging option with increased quantity per reel.

(Note: This is not an exhaustive list of alternative models. Please refer to the manufacturer's documentation for a complete list.)

In conclusion, AS4C256M8D3-15BCN is a high-capacity, fast, and reliable semiconductor memory product used in various electronic devices. Its compact size, low power consumption, and compatibility make it suitable for diverse applications across different industries.